MediaTek Dimensity 8400 chipset was launched for mobile devices on Monday. It features an all-big-core design aimed at catering to the premium smartphone market. MediaTek says its latest mobile processor offers up to 41 percent improvement over its predecessor – the Dimensity 8300 – when it comes to multi-core performance. It also supports artificial intelligence (AI) capabilities, courtesy of a dedicated Neural Processing Unit (NPU), which can accelerate generative AI tasks.
MediaTek says that Android devices powered by its latest Dimensity 8400 SoC are expected to be available in the market by the end of 2024. Xiaomi has already confirmed that its upcoming Redmi Turbo 4, which is speculated to launch early next year, will be powered in China. By this chipset.
According to MediaTek, the Dimensity 8400 chipset sits above the Dimensity 8300 as its latest processor for mobile devices. The chip has eight Arm Cortex-A725 cores, with a maximum clock speed of 4.32GHz, although the cores have separate memory caches. It is claimed to provide 41 percent improvement in multi-core performance. The chip maker says its processor can precisely control the CPU’s power curve, reducing power consumption by 44 percent.
It is paired with the Arm Mali-G720 GPU that delivers 24 percent higher performance and 42 percent higher power efficiency compared to the Dimensity 8300 SoC. MediaTek has bundled the GPU with MediaTek Frame Rate Converter (MFRC) for better gameplay and MediaTek Adaptive Gaming Technology (MAGT) 3.0 for real-time performance optimization.
The company says that devices running on this chipset will support LPDDR5x RAM and UFS 4.0 storage.
Jumping on the AI bandwagon, the Dimensity 8400 SoC features the MediaTek NPU 880, which supports generative AI tasks. Additionally, the company brings the new Dimension Agent AI Engine (DAE), which was first introduced with the Dimensity 9400 chip, to its latest mobile processors. It is claimed to transform traditional AI applications into sophisticated agentic AI applications. According to MediaTek, the chip can deliver 21 percent faster output in Stable Diffusion v1.5 and 33 percent faster text-generation in China’s Beichuan 4B AI model compared to its predecessor.
Smartphones equipped with the Dimensity 8400 chip will be able to support a 320-megapixel camera sensor that will take advantage of the built-in MediaTek Imagick 1080 ISP that uses QPD Remosaic technology to capture more light and focus faster. It supports video capture and playback up to 4K resolution at 60 frames per second (fps). The chip supports on-device displays with a maximum WQHD resolution with a 144Hz refresh rate. Additionally, it can run devices with dual screens.
For connectivity, the Dimensity 8400 SoC brings MediaTek’s 5G-A modem with up to 5.17 Gbps performance and support for Wi-Fi 6E and Bluetooth 5.4. According to MediaTek, the Dimensity 8400 supports satellite systems like QZSS, Galileo, BeiDou, GLONASS, NavIC, and GPS. It also comes with MediaTek UltraSave 3.0+ technology to deliver greater efficiency on 5G networks.
